Traditional 2D NAND-based flash memory has been a workhorse of our digital storage economy, but its architecture has reached its physical limits, so suppliers are moving on to the next generation: 3D ...

Micron Technology, Inc.MU recently announced the availability of 64-layered, second generation 3D NAND storage solutions in three different capacities of 64GB, 128GB and 256GB. These new storage ...

Rob Crooke, the Vice President and General Manager of the NVM (Non-Volatile Memory) Solutions Group at Intel, announced the impending release of 3D NAND at Intel's Investor Meeting. Incidentally, the ...

The rise of big data and the demand for real-time information is putting more pressure than ever on enterprise storage. Read now As the term suggests, 3D NAND adds a new dimension to producing flash ...

Samsung Electronics is keenly exploring "hafnia ferroelectrics" as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers of 3D NAND and ...

For years, many have predicted the end of flash memory scaling, particularly NAND, but the technology continues to defy the odds as it moves down the process curve. Still, there are signs that the ...

Silicon has been with us for many decades but will need a replacement. For NAND storage, it has become increasingly difficult to progress by shrinking the process. The chief way to combat this is to ...

In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its high-density storage ...

After some delays and uncertainty in past years, the 3D NAND market is finally heating up. In 2013 and 2014, Samsung was the only vendor participating in the 3D NAND market. Most other suppliers were ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Western Digital Corp. (NASDAQ: WDC) today announced that it has successfully developed its fifth-generation 3D NAND technology, BiCS5, continuing the company’s ...

Check out more coverage of the 2022 Flash Memory Summit. Micron has started mass production of its most advanced triple-level-cell (TLC) 3D NAND chips made up of 232 layers of memory cells, pulling ...