Celeritas HM50 FEA – Standard PCB at 18 ppm/°C (left) vs. PCB with HM50 at 10 ppm/°C (right). FR4 PCB baseline fails JEDEC qualification, while the PCB with HM50 shows >100× improvement. Warpage and ...
MUNICH, May 30, 2023 /PRNewswire/ -- ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a first-of-its-kind equipment for ...
The Thermal Mismatch Problem Constraining Large-Format AI Chips Has Been Solved: ACCM's Celeritas HM50 & HM001 Address Warpage, Package Bow, and Signal Loss Advanced Chip and Circuit Materials today ...
"With the growing adoption of Advanced Packaging technologies, we see that warpage is becoming an increasingly more complex issue in semiconductor manufacturing," says Laurent Giai-Miniet, CEO of ERS ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Advanced Chip and Circuit Materials today announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, ...
Advanced Chip and Circuit Materials today announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, package bow, solder fatigue, and high ...
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