Copper-copper bonding is emerging as a pivotal technology in three-dimensional integration, offering a viable pathway towards overcoming the limitations of traditional interconnect methods. By ...

A new technical paper titled “Co-Optimization of Power Delivery Network Design for 3D Heterogeneous Integration of RRAM-based Compute In-Memory Accelerators” was published by researchers at Georgia ...

The demand for high performance computing, next-gen servers, and AI accelerators is growing rapidly, increasing the need for faster data processing with expanding workloads. This rising complexity ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures "VECTOR TEOS 3D deposits the ...

Data science has become an important catalyst for innovation. With this, businesses can analyze massive amounts of data to derive insights, anticipate trends and make informed choices. But data ...

A study has revealed how 3D-printed concrete columns with GFRP reinforcement perform under pressure - offering new insights into structural design, durability, and the future of automated construction ...