Semiconductor logic and memory technology development continues to push the limits of process complexity and cost, especially as the industry migrates to the 5 nm node and beyond. Optimization of the ...
This blog post was authored by Mo Elsayed Senior Associate and Senior Building Performance Analyst, Page; Jill Kurtz, LEED AP BD+ C, Principal and Director of Building Sciences, Page; and Justin ...
We first developed a virtual device structure to test how ALD thickness affects hole size uniformity and CD. We started our virtual experiment by using two crisscross SAQP processes and transferring a ...
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