Abstract: We evaluate block-level power-performance-area benefits of backside power delivery networks (BSPDNs) in power switched designs, using Through Silicon Via in the Middle of Line (TSVM) in an ...
Abstract: We have proposed a structure design of single-photon avalanche diode fabricated in the Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) 0.18-$\mu \text{m}$ high-voltage (HV) CMOS ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback