MIT’s prototype points to a future where chips move data millimeters less and save orders of magnitude more energy.

MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.

Over the past decades, engineers have introduced numerous technologies that rely on light and its underlying characteristics.

Paper detailing this breakthrough to be published by the Institute of Electrical and Electronics Engineers (IEEE) as part of a project under the National ...

BISC is an ultra-thin, single-chip brain-computer interface that sits between the brain and skull and uses 65,536 electrodes. The implant streams high-bandwidth neural data over a custom UWB link to a ...

What many engineers once saw as a flaw in organic electronics could actually make these devices more stable and reliable, ...

Researchers have made a major advance in quantum computing with a new device that is nearly 100 times smaller than the ...