MIT’s prototype points to a future where chips move data millimeters less and save orders of magnitude more energy.

MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.

Over the past decades, engineers have introduced numerous technologies that rely on light and its underlying characteristics.

Paper detailing this breakthrough to be published by the Institute of Electrical and Electronics Engineers (IEEE) as part of a project under the National ...

A sub-class of Si spin qubits uses metal-oxide-semiconductor (MOS) quantum dots to confine the electrons, a structure that ...

Could Be Built by the Assembly of Different Silicon Technologies at Wafer Level, Allowing the Dense Co-integration of Best-In Class Functions.

Enter the realm of radiation hardness and space-qualified power system designs that employ gallium-nitride power semiconductors.

New start-ups offer components for quantum computers ...

BISC is an ultra-thin, single-chip brain-computer interface that sits between the brain and skull and uses 65,536 electrodes. The implant streams high-bandwidth neural data over a custom UWB link to a ...

Their paper details 3D sequential integration of silicon-germanium (SiGe) heterojunction bipolar transistors (HBT), RF SOI switches, and high-quality passives on a single wafer—opening a path to ...

What many engineers once saw as a flaw in organic electronics could actually make these devices more stable and reliable, ...