Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...
Abstract: The demands for improved performance, lower cost, and better signal integrity in 3-D packaging technology led to the development of through silicon via (TSV). However, TSV fabrication, ...
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