What many engineers once saw as a flaw in organic electronics could actually make these devices more stable and reliable, ...

MIT researchers have developed a new fabrication method that could enable the production of more energy efficient electronics by stacking multiple functional components on top of one existing circuit.

As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...

Materials informatics combines data analytics and engineering design, streamlining material development and enhancing performance through AI integration.

Non-tech companies continue efforts to count on AI to transform operations and competitiveness. Infrastructure consulting giant AECOM has ...

ATLANTA, Dec. 8, 2025 /PRNewswire/ -- Graphic Packaging Holding Company (NYSE: GPK) ("Graphic Packaging" or the "Company"), a ...