What many engineers once saw as a flaw in organic electronics could actually make these devices more stable and reliable, ...

As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...

Materials informatics combines data analytics and engineering design, streamlining material development and enhancing performance through AI integration.

Non-tech companies continue efforts to count on AI to transform operations and competitiveness. Infrastructure consulting giant AECOM has ...

ATLANTA, Dec. 8, 2025 /PRNewswire/ -- Graphic Packaging Holding Company (NYSE: GPK) ("Graphic Packaging" or the "Company"), a ...

The rapid evolution of quantum materials has opened new frontiers in next-generation electronics, energy storage, and quantum computing. However, their ...

Researchers at Universidad Carlos III de Madrid (UC3M) have developed a set of innovative methods and algorithms that improve ...

Abstract: With the continuous advancement of urbanization, the paving area of squares and roads has greatly increased, and patches of cement and bricks have replaced the original vegetation and soil.

AI is poised to revolutionize the way new materials are discovered and deployed, a shift that has the potential to speed up the development of novel materials necessary for the future U.S. energy ...

Abstract: In this article, we honor Prof. John W. Bandler and his legacy in RF and microwave modeling and automated design optimization. We showcase his pioneering breakthroughs in minimax ...