Carccu® Introduces Flower Bouquet Wrapping Paper Trends for 2026

New trends in color, material, and practical design shaping floral packaging for the year ahead We design our paper to ...

These paper batteries made from plants want to replace AA and AAA cells

At this year's show, Flint wasn't showing off just lab prototypes. The batteries running toy trains at its booth were production-grade AA and AAA cells made ...
IEEE

Redistribution-Layers for Fan-Out Wafer-Level Packaging and Heterogeneous Integrations

Abstract: Redistribution layers (RDLs) are the most integral part of wafer-level packaging (WLP) [1, 2], especially for fan-out wafer-level packaging (FOWLP) and heterogeneous integrations [3]. For ...
The New York Times

Our Favorite Paper Planners

We independently review everything we recommend. When you buy through our links, we may earn a commission. Learn more› By Jackie Reeve, Kaitlyn Wells and Melanie Pinola You can find plenty of phone ...
IEEE

0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatures with SiCN Bond Layer

Abstract: 3D integration by adopting wafer-to-wafer (W2W) or chip-to-wafer (C2W) direct bonding techniques scales up interconnect density. Heterogenous integration enabled by direct bonding technology ...