Digital Photography Review

Partially stacked sensors quietly deliver the IQ breakthrough we've been hoping for

Partially stacked sensors are essentially conventional BSI chips with more complex readout circuitry around the edge (the ...
Electronic Specifier

Imec unveils scalable quantum dot SWIR sensor platform on 300 mm CMOS wafers

Presenting at the IEEE International Electron Devices Meeting in San Francisco this week, the organisation announced that it ...
Nanowerk

Microscale CMOS chip reshapes optical control for scalable quantum computers

CMOS-built optical phase modulators shrink laser control hardware and power use for trapped atom quantum computers, enabling ...

Colloidal quantum dot photodiodes integrated on metasurfaces for compact SWIR sensors

This week, at the IEEE International Electron Devices Meeting (IEDM 2025), imec, a research and innovation hub in advanced ...

Chip-scale magnetometer uses light for high-precision magnetic sensing

Researchers have developed a precision magnetometer based on a special material that changes optical properties in response ...
IEEE

Foreign Object Detection in Wireless Charging of Electric Vehicles Using Integrated Dual-Modality Sensor Array

Abstract: Effective solution of foreign object detection (FOD) in the charging area is crucial for ensuring safety and efficiency in wireless charging for electric ...
DATAQUEST

Cyient Semiconductors qualifies for key bid in SCL Mohali revamp

Cyient Semiconductors will now supply and qualify three foundational process technologies—RF-CMOS, BCD (HV LDMOS), and CMOS ...
IEEE

A Fully Digital Indirect Time-of-Flight Image Sensor With Multi-Frame Integration and Time-Gated Single-Photon Counting Method

Abstract: This paper presents an indirect time-of-flight (iToF) image sensor, based on a single-photon avalanche diode (SPAD) and a time-gated single-photon counting (TGSPC) method. The SPAD detects ...