What many engineers once saw as a flaw in organic electronics could actually make these devices more stable and reliable, ...
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...
Materials informatics combines data analytics and engineering design, streamlining material development and enhancing performance through AI integration.
Non-tech companies continue efforts to count on AI to transform operations and competitiveness. Infrastructure consulting giant AECOM has ...
ATLANTA, Dec. 8, 2025 /PRNewswire/ -- Graphic Packaging Holding Company (NYSE: GPK) ("Graphic Packaging" or the "Company"), a ...
The rapid evolution of quantum materials has opened new frontiers in next-generation electronics, energy storage, and quantum computing. However, their ...
Researchers at Universidad Carlos III de Madrid (UC3M) have developed a set of innovative methods and algorithms that improve ...
The AI-driven framework of optimizing the mechanical property of 2D-PHS. Two-dimensional patterned hollow structures (2D-PHS) are an advanced class of metamaterials known for their unique mechanical ...
Google announced new features for Wear OS 6 at Google I/O 2025 today, giving the operating system a design makeover with Material 3 Expressive, the design language the company unveiled earlier this ...
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